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Journal: Polymers, 2023
Volume: 15
Number: 2526
Article:
Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials
Authors:
by
David Kalaš, Radek Soukup, Jan Řeboun, Michaela Radouchová, Pavel Rous and Aleš Hamáček
Link:
https://www.mdpi.com/2073-4360/15/11/2526
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