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Journal: Polymers, 2022
Volume: 14
Number: 2950
2950
Article: Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging
Authors: by William Anderson Lee Sanchez, Jia-Wun Li, Hsien-Tang Chiu, Chih-Chia Cheng, Kuo-Chan Chiou, Tzong-Ming Lee and Chih-Wei Chiu
Link: https://www.mdpi.com/2073-4360/14/14/2950

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