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Article

Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining

ICT Creative Research Laboratory/Materials & Components Research Division/Emerging Materials Research Section at Electronics and Telecommunications Research Institute (ETRI), 218 Gajeong-ro, Yuseong-gu, Daejeon 34129, Korea
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Academic Editor: Emin Bayraktar
Polymers 2021, 13(6), 957; https://doi.org/10.3390/polym13060957
Received: 15 February 2021 / Revised: 14 March 2021 / Accepted: 18 March 2021 / Published: 20 March 2021
(This article belongs to the Section Polymer Processing and Engineering)
An epoxy-based solder paste (ESP) is a promising alternative to conventional solder pastes to improve the reliability of fine-pitch electrical joining because the epoxy encapsulates the solder joint. However, development of an appropriate epoxy formulation and investigation of its reaction mechanism with solder powder is challenging. In this study, we demonstrate a newly designed ESP consisting of diglycidyl ether of bisphenol F (DGEBF) resin, Sn-3.0 Ag-0.5 Cu (SAC305) solder powder, and L-glutamic acid (Glu), which is a proteinogenic amino acid for biosynthesis of proteins in living systems. The mechanism of the thermochemical reaction was explored and tentatively proposed, which reveals that the products of the reaction between SAC305 and Glu function as catalysts for the etherification of epoxides and alcohols produced by chemical bonding between DGEBF and Glu, consequently leading to highly crosslinked polymeric networks and an enhancement of impact resistance. Our findings provide further insight into the mechanism of the reaction between various formulations comprising an epoxy, amino acid, and solder powder, and their potential use as ESPs for electrical joining. View Full-Text
Keywords: epoxy-based solder paste; l-glutamic acid; tin carboxylate salt; etherification; electrical joining epoxy-based solder paste; l-glutamic acid; tin carboxylate salt; etherification; electrical joining
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MDPI and ACS Style

Choi, G.-M.; Jang, K.-S.; Choi, K.-S.; Joo, J.; Yun, H.-G.; Lee, C.; Eom, Y.-S. Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining. Polymers 2021, 13, 957. https://doi.org/10.3390/polym13060957

AMA Style

Choi G-M, Jang K-S, Choi K-S, Joo J, Yun H-G, Lee C, Eom Y-S. Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining. Polymers. 2021; 13(6):957. https://doi.org/10.3390/polym13060957

Chicago/Turabian Style

Choi, Gwang-Mun, Ki-Seok Jang, Kwang-Seong Choi, Jiho Joo, Ho-Gyeong Yun, Chanmi Lee, and Yong-Sung Eom. 2021. "Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining" Polymers 13, no. 6: 957. https://doi.org/10.3390/polym13060957

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