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Journal: Polymers, 2021
Volume: 13
Number: 3085

Article: Characterization of Cure Behavior in Epoxy Using Molecular Dynamics Simulation Compared with Dielectric Analysis and DSC
Authors: by Shuang Yan, Wolfgang Verestek, Harald Zeizinger and Siegfried Schmauder
Link: https://www.mdpi.com/2073-4360/13/18/3085

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