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Article

3D Interconnected Boron Nitride Networks in Epoxy Composites via Coalescence Behavior of SAC305 Solder Alloy as a Bridging Material for Enhanced Thermal Conductivity

School of Chemical Engineering & Materials Science, Chung-Ang University, Seoul 156–756, Korea
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Polymers 2020, 12(9), 1954; https://doi.org/10.3390/polym12091954
Received: 31 July 2020 / Revised: 25 August 2020 / Accepted: 27 August 2020 / Published: 28 August 2020
(This article belongs to the Special Issue Applied Conductive Polymer Materials)
In this study, hybrid fillers of spherically shaped aggregated boron nitride (a-BN) attached with SAC305, were fabricated via simple stirring and the vacuum filtration method. a-BN was used as the primary conductive filler incorporated with epoxy resin, and these fillers were interconnected each other via the coalescence behavior of SAC305 during the thermal curing process. Based on controlled a-BN content (1 g) on 3 g of epoxy, the thermal conductivity of the composite filled with hybrid filler (a-BN:SAC305 = 1:0.5) reached 0.95 W/mK (33 wt%) due to the construction of the 3D filler network, whereas that of composite filled with raw a-BN was only 0.60 W/mK (25 wt%). The thermal conductivity of unfilled epoxy was 0.19 W/mK. View Full-Text
Keywords: composites; epoxy; boron nitride; SAC305; thermal conductivity; 3D structure; coalescence composites; epoxy; boron nitride; SAC305; thermal conductivity; 3D structure; coalescence
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MDPI and ACS Style

Kim, Y.; Kim, J. 3D Interconnected Boron Nitride Networks in Epoxy Composites via Coalescence Behavior of SAC305 Solder Alloy as a Bridging Material for Enhanced Thermal Conductivity. Polymers 2020, 12, 1954. https://doi.org/10.3390/polym12091954

AMA Style

Kim Y, Kim J. 3D Interconnected Boron Nitride Networks in Epoxy Composites via Coalescence Behavior of SAC305 Solder Alloy as a Bridging Material for Enhanced Thermal Conductivity. Polymers. 2020; 12(9):1954. https://doi.org/10.3390/polym12091954

Chicago/Turabian Style

Kim, Youjin, and Jooheon Kim. 2020. "3D Interconnected Boron Nitride Networks in Epoxy Composites via Coalescence Behavior of SAC305 Solder Alloy as a Bridging Material for Enhanced Thermal Conductivity" Polymers 12, no. 9: 1954. https://doi.org/10.3390/polym12091954

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