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Curing and Characteristics of N,N,N′,N′-Tetraepoxypropyl-4,4′-Diaminodiphenylmethane Epoxy Resin-Based Buoyancy Material

School of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, China
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Polymers 2019, 11(7), 1137; https://doi.org/10.3390/polym11071137
Received: 4 June 2019 / Revised: 27 June 2019 / Accepted: 28 June 2019 / Published: 3 July 2019
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Abstract

Buoyancy material is a type of low-density and high-strength composite material which can provide sufficient buoyancy with deep submersibles. A new buoyancy material with N,N,N′,N′-tetraepoxypropyl-4,4′-diaminodiphenylmethane epoxy resin (AG-80) and m-xylylenediamine (m-XDA) curing agent as matrix and hollow glass microsphere (HGM) as the filler is prepared. The temperature and time of the curing process were determined by the calculations of thermal analysis kinetics (TAK) through differential scanning calorimetry (DSC) analysis. The results show that the better mass ratio of AG-80 with m-XDA is 100/26. Combined TAK calculations and experimental results lead to the following curing process: pre-curing at 75 °C for 2 h, curing at 90 °C for 2 h, and post-curing at 100 °C for 2 h. The bulk density, compressive strength, and saturated water absorption of AG-80 epoxy resin-based buoyancy material were 0.729 g/cm3, 108.78 MPa, and 1.23%, respectively. Moreover, this type of buoyancy material can resist the temperature of 250 °C. View Full-Text
Keywords: buoyancy material; epoxy resin; DSC; thermal analysis kinetics buoyancy material; epoxy resin; DSC; thermal analysis kinetics
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Yu, S.; Li, X.; Guo, X.; Li, Z.; Zou, M. Curing and Characteristics of N,N,N′,N′-Tetraepoxypropyl-4,4′-Diaminodiphenylmethane Epoxy Resin-Based Buoyancy Material. Polymers 2019, 11, 1137.

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