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Journal: Polymers, 2019
Volume: 11
Number: 940

Article: Study on Delamination Between Polymer Materials and Metals in IC Packaging Process
Authors: by Cheng-Tang Pan, Shao-Yu Wang, Chung-Kun Yen, Chien-Kai Ho, Jhan-Foug Yen, Shi-Wei Chen, Fan-Rui Fu, Yi-Tzu Lin, Cing-Hao Lin, Ajay Kumar and Yow-Ling Shiue
Link: https://www.mdpi.com/2073-4360/11/6/940

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