Next Article in Journal
A Sandwich-Structured Piezoresistive Sensor with Electrospun Nanofiber Mats as Supporting, Sensing, and Packaging Layers
Next Article in Special Issue
Application of the Products from the Maillard Reaction of Polyglutamic Acid and Glucose to Prepare Colored and Bioactive Silk
Previous Article in Journal
Electrospun Polyethylene Terephthalate Nonwoven Reinforced Polypropylene Separator: Scalable Synthesis and Its Lithium Ion Battery Performance
Previous Article in Special Issue
Modeling of Flexible Polyurethane Foam Shrinkage for Bra Cup Moulding Process Control
Article Menu
Issue 6 (June) cover image

Export Article

Open AccessReview
Polymers 2018, 10(6), 573;

Polymer Interface Molecular Engineering for E-Textiles

School of Materials, University of Manchester, Oxford Road, Manchester M13 9PL, UK
Author to whom correspondence should be addressed.
Received: 30 April 2018 / Revised: 18 May 2018 / Accepted: 21 May 2018 / Published: 23 May 2018
(This article belongs to the Special Issue Polymer Processing for Enhancing Textile Application)
Full-Text   |   PDF [9915 KB, uploaded 23 May 2018]   |  


Wearable electronics, regarded as the next generation of conventional textiles, have been an important concept in the study of e-textiles. Conductive fibres are the upstreaming of e-textiles and have witnessed the booming development in recent years. However, little work has focused on improving the wash ability and durability of conductive fibres. As a new approach to manufacturing conductive fibres, Polymer Interface Molecular Engineering (PIME) is starting to be employed recently, to build up an interfacial layer on polymeric fibre surfaces; this interfacial layer services as a platform to anchor catalysts for the following metal Electroless Deposition (ELD). The designed interfacial layer significantly increases adhesion between polymeric substrates and coating metal layers, to improve the durability of e-textiles. This review highlights recent research into different molecular and architectural design strategies, and its potential application for wearable electronics. Further challenges and opportunities in this field are also discussed critically. View Full-Text
Keywords: electroless deposition; polymer interface molecular engineering; wearable electronics; conductive fibres electroless deposition; polymer interface molecular engineering; wearable electronics; conductive fibres

Graphical abstract

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).

Share & Cite This Article

MDPI and ACS Style

Zhu, C.; Li, Y.; Liu, X. Polymer Interface Molecular Engineering for E-Textiles. Polymers 2018, 10, 573.

Show more citation formats Show less citations formats

Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Related Articles

Article Metrics

Article Access Statistics



[Return to top]
Polymers EISSN 2073-4360 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top