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Polymers 2018, 10(6), 573; https://doi.org/10.3390/polym10060573

Polymer Interface Molecular Engineering for E-Textiles

School of Materials, University of Manchester, Oxford Road, Manchester M13 9PL, UK
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Received: 30 April 2018 / Revised: 18 May 2018 / Accepted: 21 May 2018 / Published: 23 May 2018
(This article belongs to the Special Issue Polymer Processing for Enhancing Textile Application)
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Abstract

Wearable electronics, regarded as the next generation of conventional textiles, have been an important concept in the study of e-textiles. Conductive fibres are the upstreaming of e-textiles and have witnessed the booming development in recent years. However, little work has focused on improving the wash ability and durability of conductive fibres. As a new approach to manufacturing conductive fibres, Polymer Interface Molecular Engineering (PIME) is starting to be employed recently, to build up an interfacial layer on polymeric fibre surfaces; this interfacial layer services as a platform to anchor catalysts for the following metal Electroless Deposition (ELD). The designed interfacial layer significantly increases adhesion between polymeric substrates and coating metal layers, to improve the durability of e-textiles. This review highlights recent research into different molecular and architectural design strategies, and its potential application for wearable electronics. Further challenges and opportunities in this field are also discussed critically. View Full-Text
Keywords: electroless deposition; polymer interface molecular engineering; wearable electronics; conductive fibres electroless deposition; polymer interface molecular engineering; wearable electronics; conductive fibres
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Zhu, C.; Li, Y.; Liu, X. Polymer Interface Molecular Engineering for E-Textiles. Polymers 2018, 10, 573.

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