Crystals 2017, 7(7), 185; https://doi.org/10.3390/cryst7070185
Microstructure and Electrical Properties of Fe,Cu Substituted (Co,Mn)3O4 Thin Films
1
Faculty of Electronics, Telecommunications and Informatics, Gdansk University of Technology, ul. G. Narutowicza 11/12, 80-233 Gdansk, Poland
2
Department of Energy Conversion and Storage, Technical University of Denmark, Risø Campus, Frederiksborgvej 399, 4000 Roskilde, Denmark
*
Author to whom correspondence should be addressed.
Academic Editor: Stevin Pramana
Received: 19 May 2017 / Revised: 14 June 2017 / Accepted: 17 June 2017 / Published: 23 June 2017
(This article belongs to the Special Issue Crystal Structure of Electroceramics)
Abstract
In this work, thin films (~1000 nm) of a pure MnCo2O4 spinel together with its partially substituted derivatives (MnCo1.6Cu0.2Fe0.2O4, MnCo1.6Cu0.4O4, MnCo1.6Fe0.4O4) were prepared by spray pyrolysis and were evaluated for electrical conductivity. Doping by Cu increases the electrical conductivity, whereas doping by Fe decreases the conductivity. For Cu containing samples, rapid grain growth occurs and these samples develop cracks due to a potentially too high thermal expansion coefficient mismatch to the support. Samples doped with both Cu and Fe show high electrical conductivity, normal grain growth and no cracks. By co-doping the Mn, Co spinel with both Cu and Fe, its properties can be tailored to reach a desired thermal expansion coefficient/electrical conductivity value. View Full-TextKeywords:
manganese cobalt spinel; high temperature protective coatings; thin films; electrical conductivity
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Szymczewska, D.; Molin, S.; Hendriksen, P.V.; Jasiński, P. Microstructure and Electrical Properties of Fe,Cu Substituted (Co,Mn)3O4 Thin Films. Crystals 2017, 7, 185.
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