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Journal: Crystals, 2023
Volume: 13
Number: 586
586
Article: Microstructural Evolution and Deterioration of Shear Properties of Sn3.0Ag0.5Cu/Cu Solder Joints after Long-Term Storage at Cryogenic Temperatures
Authors: by Xiaotong Guo, Xinlang Zuo, Hao He, Hui Xiao, Jiahao Liu, Ruyu Tian and Yufeng Liu
Link: https://www.mdpi.com/2073-4352/13/4/586

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