Guo, X.; Zuo, X.; He, H.; Xiao, H.; Liu, J.; Tian, R.; Liu, Y.
Microstructural Evolution and Deterioration of Shear Properties of Sn3.0Ag0.5Cu/Cu Solder Joints after Long-Term Storage at Cryogenic Temperatures. Crystals 2023, 13, 586.
https://doi.org/10.3390/cryst13040586
AMA Style
Guo X, Zuo X, He H, Xiao H, Liu J, Tian R, Liu Y.
Microstructural Evolution and Deterioration of Shear Properties of Sn3.0Ag0.5Cu/Cu Solder Joints after Long-Term Storage at Cryogenic Temperatures. Crystals. 2023; 13(4):586.
https://doi.org/10.3390/cryst13040586
Chicago/Turabian Style
Guo, Xiaotong, Xinlang Zuo, Hao He, Hui Xiao, Jiahao Liu, Ruyu Tian, and Yufeng Liu.
2023. "Microstructural Evolution and Deterioration of Shear Properties of Sn3.0Ag0.5Cu/Cu Solder Joints after Long-Term Storage at Cryogenic Temperatures" Crystals 13, no. 4: 586.
https://doi.org/10.3390/cryst13040586
APA Style
Guo, X., Zuo, X., He, H., Xiao, H., Liu, J., Tian, R., & Liu, Y.
(2023). Microstructural Evolution and Deterioration of Shear Properties of Sn3.0Ag0.5Cu/Cu Solder Joints after Long-Term Storage at Cryogenic Temperatures. Crystals, 13(4), 586.
https://doi.org/10.3390/cryst13040586
