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Journal: Crystals, 2022
Volume: 12
Number: 1736
Article:
Applicability Evaluation of Nano-Al2O3 Modified Sn-Ag-Cu Solder in High-Density Electronic Packaging Subjected to Thermal Cycling
Authors:
by
Jie Wu, Guoqiang Huang, Yiping Wu, Xiwu Huang, Rui Yu, Xuqi Yang, Guangyao Chen, Cheelong Tan, Zhihao Yu, Huabin Sun and Yong Xu
Link:
https://www.mdpi.com/2073-4352/12/12/1736
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