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Journal: Micromachines, 2026
Volume: 17
Number: 187

Article: Processing Characteristics of Ultra-Precision Cutting of 4H-SiC Wafers by Dicing Blade
Authors: by Yufang Wang, Zhixiong Li, Fengjun Chen and Zhiqiang Xu
Link: https://www.mdpi.com/2072-666X/17/2/187

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