Resist Filling Study for UV Nanoimprint Lithography Using Stamps with Various Micro/Nano Ratios
Abstract
:1. Introduction
2. Design of Stamps and Processes
3. Results and Discussion
3.1. Results of Feature-Scale Imprint
3.2. Results of Chip-Scale Imprint
4. Conclusions
Author Contributions
Funding
Conflicts of Interest
References
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Micro/Nano Ratios | 1:1 | 1:2 | 1:3 |
---|---|---|---|
Final Residual Layer Thickness (RLT) (nm) | 56.5 | 58.9 | 59.8 |
Proportion of cavities locally >95% filled | 50% | 27% | 20% |
Min cavity filling extent | 91.24% | 91.84% | 92.23% |
Max cavity filling extent | 100% | 100% | 100% |
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Yin, M.; Sun, H.; Wang, H. Resist Filling Study for UV Nanoimprint Lithography Using Stamps with Various Micro/Nano Ratios. Micromachines 2018, 9, 335. https://doi.org/10.3390/mi9070335
Yin M, Sun H, Wang H. Resist Filling Study for UV Nanoimprint Lithography Using Stamps with Various Micro/Nano Ratios. Micromachines. 2018; 9(7):335. https://doi.org/10.3390/mi9070335
Chicago/Turabian StyleYin, Minqi, Hongwen Sun, and Haibin Wang. 2018. "Resist Filling Study for UV Nanoimprint Lithography Using Stamps with Various Micro/Nano Ratios" Micromachines 9, no. 7: 335. https://doi.org/10.3390/mi9070335