Next Article in Journal
Design and Fabrication of a Three-Dimensional Artificial Compound Eye Using Two-Photon Polymerization
Previous Article in Journal
Kinematics Error Compensation for a Surface Measurement Probe on an Ultra-Precision Turning Machine
Open AccessArticle

Resist Filling Study for UV Nanoimprint Lithography Using Stamps with Various Micro/Nano Ratios

by 1,2, 1,2,* and 1,2
1
College of Internet of Things Engineering, Hohai University, Changzhou 213022, China
2
Jiangsu Key Laboratory of Power Transmission and Distribution Equipment Technology, 200 JinLing Road North, Changzhou 213022, China
*
Author to whom correspondence should be addressed.
Micromachines 2018, 9(7), 335; https://doi.org/10.3390/mi9070335
Received: 23 May 2018 / Revised: 26 June 2018 / Accepted: 29 June 2018 / Published: 2 July 2018
Mixed micro- and nanoscale structures are gaining popularity in various fields due to their rapid advances in patterning. An investigation in stamp resist filling with multiscale cavities via ultraviolet (UV) nanoimprint lithography (UV-NIL) is necessary to improve stamp design. Here, simulations at the level of individual features were conducted to explain different filling behaviors of micro- and nanoscale line patterns. There were noticeable interactions between the micro-/nanoscale cavities. These delayed the resist filling process. Several chip-scale simulations were performed using test patterns with different micro/nano ratios of 1:1, 1:2, and 1:3. There were some minor influences that changed the micro/nano ratios on overall imprint qualities. During the imprinting process, the pressure difference at the boundary between micro- and nanoscale patterns became obvious, with a value of 0.04 MPa. There was a thicker residual layer and worse cavity filling when the proportion of nanoscale structures increased. View Full-Text
Keywords: resist filling; micro/nano ratios; ultraviolet (UV) nanoimprint lithography; multiscale cavities; stamp resist filling; micro/nano ratios; ultraviolet (UV) nanoimprint lithography; multiscale cavities; stamp
Show Figures

Figure 1

MDPI and ACS Style

Yin, M.; Sun, H.; Wang, H. Resist Filling Study for UV Nanoimprint Lithography Using Stamps with Various Micro/Nano Ratios. Micromachines 2018, 9, 335.

Show more citation formats Show less citations formats
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Article Access Map by Country/Region

1
Search more from Scilit
 
Search
Back to TopTop