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Journal: Micromachines, 2018
Volume: 9
Number: 138
Article:
Fabrication of Through via Holes in Ultra-Thin Fused Silica Wafers for Microwave and Millimeter-Wave Applications
Authors:
by
Xiao Li, King Yuk Chan and Rodica Ramer
Link:
https://www.mdpi.com/2072-666X/9/3/138
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