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Micromachines 2017, 8(9), 277;

Ultra-Stretchable Interconnects for High-Density Stretchable Electronics

Department of Mechanical Engineering, Eindhoven University of Technology, 5600 MB Eindhoven, The Netherlands
Department of Microelectronics, Delft University of Technology, 2628 CD Delft, The Netherlands
Philips Research, High Tech Campus 4, 5656 AE Eindhoven, The Netherlands
These authors should be regarded as joint first author.
Author to whom correspondence should be addressed.
Received: 10 July 2017 / Revised: 2 September 2017 / Accepted: 7 September 2017 / Published: 13 September 2017
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The exciting field of stretchable electronics (SE) promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable interconnects with micron-scale footprints, which calls for proven standardized (complementary metal-oxide semiconductor (CMOS)-type) process recipes using bulk integrated circuit (IC) microfabrication tools and fine-pitch photolithography patterning. Here, we address this combined challenge of microfabrication with extreme stretchability for high-density SE devices by introducing CMOS-enabled, free-standing, miniaturized interconnect structures that fully exploit their 3D kinematic freedom through an interplay of buckling, torsion, and bending to maximize stretchability. Integration with standard CMOS-type batch processing is assured by utilizing the Flex-to-Rigid (F2R) post-processing technology to make the back-end-of-line interconnect structures free-standing, thus enabling the routine microfabrication of highly-stretchable interconnects. The performance and reproducibility of these free-standing structures is promising: an elastic stretch beyond 2000% and ultimate (plastic) stretch beyond 3000%, with <0.3% resistance change, and >10 million cycles at 1000% stretch with <1% resistance change. This generic technology provides a new route to exciting highly-stretchable miniature devices. View Full-Text
Keywords: stretchable electronics; ultra-stretchability; complementary metal-oxide semiconductor (CMOS) processing; miniaturized interconnects; mechanical size-effects stretchable electronics; ultra-stretchability; complementary metal-oxide semiconductor (CMOS) processing; miniaturized interconnects; mechanical size-effects

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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).

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Shafqat, S.; Hoefnagels, J.P.M.; Savov, A.; Joshi, S.; Dekker, R.; Geers, M.G.D. Ultra-Stretchable Interconnects for High-Density Stretchable Electronics. Micromachines 2017, 8, 277.

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