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Micromachines 2017, 8(7), 226;

Squeeze Film Air Damping in Tapping Mode Atomic Force Microscopy

School of Instrument Science and Opto-electronics Engineering, Hefei University of Technology, Hefei 230009, China
School of Electronics and Information Engineering, Anhui Jianzhu University, Hefei 230601, China
Author to whom correspondence should be addressed.
Received: 23 May 2017 / Revised: 3 July 2017 / Accepted: 17 July 2017 / Published: 20 July 2017
(This article belongs to the Special Issue State-Of-The-Art Micromachining)
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In dynamic plowing lithography, the sample surface is indented using a vibrating tip in tapping mode atomic force microscopy. During writing, the gap between the cantilever and the sample surface is very small, usually on the order of micrometers. High vibration frequency and small distance induce squeeze film air damping from the air in the gap. This damping can cause variations in the cantilever’s vibrating parameters and affect the accuracy of the nanoscale patterning depth. In this paper, squeeze film air damping was modeled and analyzed considering the inclined angle between the cantilever and the sample surface, and its effects on the resonant amplitude and damping coefficient of the cantilever were discussed. The squeeze film air damping in the approaching curve of cantilever was observed, and its effect on fabricating nanopatterns was discussed. View Full-Text
Keywords: squeeze film air damping; damping coefficient; atomic force microscopy; dynamic plowing lithography squeeze film air damping; damping coefficient; atomic force microscopy; dynamic plowing lithography

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Zhao, Y.; Huang, Q.; Zhang, L.; Zhang, Y.; Cheng, R. Squeeze Film Air Damping in Tapping Mode Atomic Force Microscopy. Micromachines 2017, 8, 226.

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