Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducer Arrays Using Glass Reflow Process
Abstract
:1. Introduction
2. Device Structure and Working Principle
3. Experiments
3.1. Fabrication Process
3.2. Mesurement Setup
3.3. Measurement Results
4. Conclusions
Acknowledgments
Author Contributions
Conflicts of Interest
References
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Parameters | Values |
Membrane size (radius of membrane) | 100 μm |
Membrane thickness | 7 μm |
Array | 5 × 5 |
Sensing gap | 3.2 μm |
Applied conditions | Values |
Polarization voltage (VDC) | 120 V |
Alternating voltage (VAC) | 0 dBm |
Pressure level of chamber | 0.01 Pa |
Resonant frequency (Calculation) | Value |
Resonant frequency | 2.88 MHz |
FEM simulation | Value |
Resonant frequency | 2.79 MHz |
Measurement results | Values |
Resonant frequency | 2.84 MHz |
Q factor | 1300 |
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Toan, N.V.; Hahng, S.; Song, Y.; Ono, T. Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducer Arrays Using Glass Reflow Process. Micromachines 2016, 7, 76. https://doi.org/10.3390/mi7050076
Toan NV, Hahng S, Song Y, Ono T. Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducer Arrays Using Glass Reflow Process. Micromachines. 2016; 7(5):76. https://doi.org/10.3390/mi7050076
Chicago/Turabian StyleToan, Nguyen Van, Shim Hahng, Yunheub Song, and Takahito Ono. 2016. "Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducer Arrays Using Glass Reflow Process" Micromachines 7, no. 5: 76. https://doi.org/10.3390/mi7050076