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Journal: Micromachines, 2016
Volume: 7
Number: 184
184
Article: Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration
Authors: by Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka and Mitsumasa Koyanagi
Link: https://www.mdpi.com/2072-666X/7/10/184

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