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Innovative SU-8 Lithography Techniques and Their Applications

1
Department of Electrical Engineering, University of Texas, Dallas, Richardson, TX 75080, USA
2
Siliconfile Technologies, Inc., Seongnam-si, Gyeonggi-do 463-050, Korea
3
Department of Information and Communication Engineering, Hanbat National University, Daejeon 305-719, Korea
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Author to whom correspondence should be addressed.
Academic Editor: Arnaud Bertsch
Micromachines 2015, 6(1), 1-18; https://doi.org/10.3390/mi6010001
Received: 3 October 2014 / Accepted: 9 December 2014 / Published: 23 December 2014
(This article belongs to the Special Issue 15 Years of SU8 as MEMS Material)
SU-8 has been widely used in a variety of applications for creating structures in micro-scale as well as sub-micron scales for more than 15 years. One of the most common structures made of SU-8 is tall (up to millimeters) high-aspect-ratio (up to 100:1) 3D microstructure, which is far better than that made of any other photoresists. There has been a great deal of efforts in developing innovative unconventional lithography techniques to fully utilize the thick high aspect ratio nature of the SU-8 photoresist. Those unconventional lithography techniques include inclined ultraviolet (UV) exposure, back-side UV exposure, drawing lithography, and moving-mask UV lithography. In addition, since SU-8 is a negative-tone photoresist, it has been a popular choice of material for multiple-photon interference lithography for the periodic structure in scales down to deep sub-microns such as photonic crystals. These innovative lithography techniques for SU-8 have led to a lot of unprecedented capabilities for creating unique micro- and nano-structures. This paper reviews such innovative lithography techniques developed in the past 15 years or so. View Full-Text
Keywords: SU-8; lithography; backside; inclined; holographic interference SU-8; lithography; backside; inclined; holographic interference
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Lee, J.B.; Choi, K.-H.; Yoo, K. Innovative SU-8 Lithography Techniques and Their Applications. Micromachines 2015, 6, 1-18.

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