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Journal: Micromachines, 2026
Volume: 17
Number: 70
Article:
A Dynamic Physics-Guided Ensemble Model for Non-Intrusive Bond Wire Health Monitoring in IGBTs
Authors:
by
Xinyi Yang, Zhen Hu, Yizhi Bo, Tao Shi and Man Cui
Link:
https://www.mdpi.com/2072-666X/17/1/70
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