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Journal: Micromachines, 2026
Volume: 17
Number: 70

Article: A Dynamic Physics-Guided Ensemble Model for Non-Intrusive Bond Wire Health Monitoring in IGBTs
Authors: by Xinyi Yang, Zhen Hu, Yizhi Bo, Tao Shi and Man Cui
Link: https://www.mdpi.com/2072-666X/17/1/70

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