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Journal: Micromachines, 2025
Volume: 16
Number: 1057

Article: Enhancing Confidence and Interpretability of a CNN-Based Wafer Defect Classification Model Using Temperature Scaling and LIME
Authors: by Jieun Lee, Yeonwoo Ju, Junho Lim, Sungmin Hong, Soo-Whang Baek and Jonghwan Lee
Link: https://www.mdpi.com/2072-666X/16/9/1057

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