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Journal: Micromachines, 2025
Volume: 16
Number: 746

Article: Numerical Simulation of Thermal Cycling and Vibration Effects on Solder Layer Reliability in High-Power Diode Lasers for Space Applications
Authors: by Lei Cheng, Huaqing Sun, Xuanjun Dai and Bingxing Wei
Link: https://www.mdpi.com/2072-666X/16/7/746

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