1. Introduction
Gyroscopes are essential for measuring angular motion in inertial navigation and attitude control systems. Coriolis vibratory gyroscopes (CVGs), in particular, offer significant advantages over traditional gyroscopes, including extended lifespan, low power consumption, and resistance to radiation. These characteristics make CVGs ideal for high-precision applications across various domains, from aerospace to marine systems [
1].
Hemispherical resonator gyroscopes (HRGs), which employ a fully symmetric three-dimensional shell design and utilize hemispherical resonators made from high-purity fused quartz as the sensitive elements, operate in a whole-angle mode and have been reported as one of the best-performing CVGs, with widespread applications across various scenarios [
2,
3]. The manufacturing precision of the hemispherical resonator directly dictates the upper limit of the HRG’s performance. Ideally, the mass distribution of the hemispherical resonator should exhibit isotropic characteristics in the circumferential direction, with the center of mass remaining stationary during the resonance of the
N = 2 wine-glass modes. However, due to the influence of process-induced errors, the structure often exhibits geometric imperfections, leading to non-uniform mass distribution. The complex non-ideal mass distribution is typically described using Fourier series, which superimposes imbalance terms from various harmonics upon the ideal nominal mass. Among the various harmonics, the first four harmonics of the mass distribution have the most significant impact on the dynamic characteristics of the resonator and the gyroscope performance in the
N = 2 wine-glass modes.
Previous studies have extensively investigated the impact of the 4th harmonic on frequency split and mode mismatch in
N = 2 wine-glass modes [
4,
5,
6,
7,
8,
9,
10,
11,
12,
13,
14,
15,
16]. This mismatch causes standing wave drift, reducing the gyroscope’s sensitivity and potentially leading to loss of operational capability. Additionally, the requirement for greater orthogonal control forces introduces circuit noise [
5,
16]. Ion beam etching, laser ablation, and chemical etching are employed as processing techniques for frequency split trimming. Studies by Huo et al. [
14], Zhang et al. [
15], and Wang et al. [
16] using focused ion beam technology have achieved frequency splits below 0.001 Hz. Hamelin et al. introduced laser-induced methods to compensate for manufacturing defects by adjusting local stiffness near support columns [
12]. Hu et al. and Zeng et al. analyzed the effects of femtosecond laser trimming on frequency deviation, comparing hole- and groove-trimming methods [
17,
18]. Luo et al. and Pan et al. enhanced chemical etching efficiency by developing predictive models and controlling etching parameters, achieving frequency splits below 0.05 Hz [
19,
20]. While these techniques have demonstrated effectiveness in addressing frequency split, the growing demand for higher gyroscope performance necessitates a more comprehensive approach that considers the impact of multiple harmonics.
As research progresses and the performance requirements for gyroscopes escalate, the impact of the first three harmonics on the resonator and gyroscope performance has garnered significant attention from researchers. Firstly, unbalanced mass can cause support loss and reduce the quality factor of resonators. Luo et al. analyzed the support loss in cylindrical resonators with unbalanced mass [
21]. Jeanroy et al. [
3] and Remillieux and Delhaye [
22] developed a mass unbalance model showing that a defect as small as one thousandth can drop the hemispherical resonator’s quality factor from 10 million to about 0.6 million, increasing drift error by approximately 15 times. The 1st harmonic from laser processing deviations significantly impacts anchor loss [
23]. Asymmetrical trimming introduces 1st and 2nd harmonics, reducing micro-shell resonators’ quality factor by 10–90% [
24]. In addition, unbalanced mass defects in resonators cause deformation, leading to additional forces in the gyroscope’s measurement and control circuits, resulting in output drift [
25]. Non-ideal hemispherical resonators can produce parasitic forced vibrations during base excitation, suggesting the need to balance resonator defects [
26,
27]. These studies collectively indicate that the first three harmonics have numerous deleterious effects on the performance of resonators and gyroscopes; hence, it is imperative to incorporate multi-order harmonics into the mass trimming process in the future, alongside frequency split trimming.
At present, some identification and trimming techniques have involved the first three harmonics of the mass distribution. Basarab et al. investigated resonator thickness variations and developed a magnetic sensor device to detect unbalanced mass parameters in metallic cylindrical shells [
28,
29]. They also proposed a chemical etching-based balancing process [
30]. Tao et al. and Liang et al. identified the 2nd harmonic using frequency splits in
N = 1 modes and
Z-axis vibrations [
31,
32]. Ning et al. analyzed standing wave precession rates to locate unbalanced mass and improved resonator performance by removing defective mass in harmonic form [
33]. A method to identify eccentric mass in hemispherical resonators using ion beam etching was proposed, effectively suppressing the 1st and 3rd harmonics [
34]. Previous studies have predominantly focused on the trimming of frequency split (the 4th harmonic of the mass distribution) or other specific harmonics, yet there has been no systematic analysis of the interactions between multiple harmonics and the comprehensive impact laws of the trimming process. Notably, Sagem disclosed a mass balancing technique that characterized the unbalanced mass in terms of parameters of 6 degrees of freedom and frequency split in 2014. After a multi-step balancing process, the parameters in the 6 degrees of freedom were iteratively refined from 800 ppm to within 10 ppm, and the frequency split was diminished to 0.5 mHz. However, the underlying mechanism and operational details of the technique remained undisclosed [
3,
22]. With the advancement of gyroscopic performance and mass trimming techniques, the demand for trimming has expanded from the trimming of the frequency split to the multiple harmonic trimming within mass defects. However, the integrated impact patterns of etching and other trimming process parameters on multiple harmonics remain unclear, hindering the efficient implementation of comprehensive multi-harmonic trimming and thus constraining the development of mass balancing technologies.
By establishing a trimming parameter model that links the mass distribution function with the harmonic spectrum, this paper analyzes the impact of these trimming parameters. Furthermore, a discrete trimming scheme is proposed to compensate for frequency split arising during the trimming process of the first harmonic. The content of this paper is as follows: Section II analyzes the inertial force effects of the first three harmonics based on the mass ring model and identifies these harmonics using this effect. Simulations of the first three harmonics induced by structural errors are conducted. Section III establishes a trimming model to analyze the influence of process parameters on harmonics. Section IV examines the discrete trimming scheme, simulates it using the finite element method, and validates it through experiments.
4. Discrete Trimming Scheme
4.1. Frequency Split Compensation
Compared to mechanical grinding, laser ablation, and chemical etching, ion beam etching is a non-contact processing technology with atomic-level material removal capability and precise localization of micro-defects. By controlling energy density and incident angle, issues such as thermal stress, thermoelastic losses, mechanical damage, and surface contamination can be minimized, thereby reducing the impact on the quality factor [
14,
15,
16]. Ion beam etching is typically employed with a small diameter to ensure that the energy is concentrated on the target area. The diameter of a single etching groove produced is often within 3 mm, which corresponds to a width of less than π/19 (approximately 20 degrees) in a 20 mm diameter hemispherical resonator. As per the numerical analysis and simulation results mentioned earlier, under these conditions, the gradient of the harmonics introduced by the etching groove is relatively small. Therefore, single-point trimming (SPT) of the 1st harmonic also introduces higher-order harmonics, including the 4th harmonic. Various geometric structural errors necessitate a larger amount of trimming for the 1st harmonic, which consequently increases the frequency split of the
N = 2 wine-glass modes due to the 4th harmonic. Mode mismatch prevents the resonator from functioning effectively as a sensitive element in a gyroscope.
A discrete trimming (DT) method has been proposed to circumvent the mode mismatch issues associated with SPT. This method is based on a single-point etching groove, which serves as the primary etching (PE) groove corresponding to the 1st harmonic, with a trimming amount denoted as
T1. On the basis of the PE groove, auxiliary etching (AE) grooves of the same width are added at positions 45 degrees to the left and right, with trimming amounts dependent on the etching depth, each being half of the PE groove’s trimming amount, i.e.,
T1/2, to compensate for the 4th harmonic introduced by the SPT. The principle of DT method is based on the fact that the PE groove at the center introduces a 4th harmonic with its peak phase aligned with the center azimuth; meanwhile, the positions 45 degrees to the left and right of the center are both trough positions for the introduced 4th harmonic. By introducing secondary 4th harmonics at the trough positions with AE grooves, the phase of these secondary 4th harmonics is opposite to that of the original 4th harmonic, and the combined trimming effect of the two AE grooves cancels out the trimming effect of the central PE groove, achieving a compensatory effect. The total contributions of the 1st harmonic
T1′ and 4th harmonic
T4′ introduced by the three etching grooves are as follows:
According to Equation (11), the trimming amount of the central PE groove is approximately 0.6 times that required by the SPT method. This helps to mitigate the potential destructive effects on the local structure of the hemispherical resonator that may arise from excessive trimming amounts.
As shown in the mass distribution function depicted in
Figure 10a, the initial amplitude of the 1st harmonic is 10, with an orientation of 60 degrees, and all other harmonics are 0. When employing the SPT method, an etching groove with a depth of 90 and a width of 20 degrees at the 60-degree position is required to reduce the amplitude of the 1st harmonic to 0; however, this also introduces a 4th harmonic with an amplitude of 9.245 as shown in
Figure 10b. In contrast, when using the DT method, three etching grooves each with a width of 20 degrees are introduced: a central PE groove with a depth of 54, and two AE grooves each with a depth of 27. This approach can reduce the 1st harmonic to 0.2, while the 4th harmonic remains essentially unchanged.
4.2. Simulation Results
To validate the DT scheme, the rim region of the ideal hemispherical resonator model is divided into 72 equal segments. The model is imported into finite element software and initialized with silica glass material. Based on the material density
ρ0, the material density values of each segment in the rim region are assigned according to the azimuthal angle, thereby embedding various harmonics into the hemispherical resonator model:
The 1st and 4th harmonics of the density distribution are initialized with the following parameters:
ρ1 is set to 0.03 and
φ1 is set to 50 degrees, while
ρ4 is set to 0.001 and
φ4 to 0 degrees. Both the SPT and DT schemes are simulated to trim the 1st harmonic in the model. As shown in
Figure 11a,b, the segment corresponding to the orientation to be trimmed is designated as a single-point etching region, which also serves as the PE region in the DT scheme, with a width of 5 degrees and a trimming amount equal to the product of the depth coefficient
k and initial density
ρ0. Building upon the previously embedded harmonic density values
ρ(
φ), the density of the PE region is modified to the following:
In the DT method, additional regions located 45 degrees to either side are designated as PE regions, each with a width of 5 degrees. The density values assigned to these areas are as follows:
As depicted in
Figure 11c, the 1st and 4th harmonics in the density distribution are compared between the SPT and DT methods as a function of the depth coefficient
k. By employing the SPT method and increasing the depth coefficient
k of the trimming region to 1, the 1st harmonic in the density distribution is reduced from 66 kg/m
3 to 5.7 kg/m
3, a decrease by an order of magnitude. However, concurrently, the 4th harmonic increases from 2.2 kg/m
3 to 61.7 kg/m
3. When the depth coefficient
k reaches 1, the density in the trimming region is reduced to near zero, indicating that the material is almost completely removed. In practical operations, this would significantly compromise the structural integrity. In contrast, the DT method sets the depth coefficient
k of the PE region to 0.6, with the depth coefficients of AE regions on either side set to 0.3, which can reduce the 1st harmonic in the density distribution by an order of magnitude to 3.3 kg/m
3, while the 4th harmonic remains essentially unchanged.
Running the finite element simulation program initially calculates the natural frequencies to obtain the frequency split of the two N = 2 wine-glass modes; subsequently, the frequency domain calculation is performed. The results, which include the vibration data from the top of the anchor stem and the rim of the resonator, are substituted into the identification formulas to decompose and extract the 1st harmonic during the simulated etching process.
Figure 11d illustrates that when using the SPT method, as the depth coefficient
k increases to 1, the 1st harmonic decreases by one order of magnitude from 1158.5 ppm to 112.7 ppm; however, the frequency split increases dramatically by 38.2 Hz. In contrast, when employing the DT method, with the depth coefficient set to 0.6, the 1st harmonic decreases by one order of magnitude to 74.7 ppm, while the frequency split increases by only 1.4 Hz. Comparing the variations in the 1st harmonic and frequency split between the two trimming schemes, the proposed DT method effectively compensates for the frequency split caused by the SPT of the 1st harmonic. Moreover, the required depth of individual etching grooves is smaller, thus contributing to the preservation of the structural and morphological integrity of the resonator.
4.3. Experimental Results
As depicted in
Figure 12, an integrated experimental platform for harmonic identification and trimming of hemispherical resonators has been established. This experimental platform primarily comprises the following modules: a motion platform, a Laser Doppler Vibrometer (LDV), a lock-in amplifier, an ion beam system, and a vacuum chamber. The motion platform, which includes a motor, grating, rotary table, translation stage, and elevation stage, facilitates three-axis translational and rotational movements to adjust the position and attitude of the resonator sample. The LDV and lock-in amplifier are utilized for modal testing and vibration data acquisition. The ion beam system enables continuous etching of the resonator’s surface to remove material for harmonic trimming. The controllable atmospheric pressure within the vacuum chamber provides a suitable operating environment for both the resonator and the ion beam system.
After assembly with the measurement and control circuitry, the hemispherical resonator sample to be tested is secured on the motion platform. Initially, the position and attitude of the resonator sample are adjusted using the motion platform to enable the LDV to direct the laser onto the sample for acquiring mechanical vibration signals. Via the electrical interface in the vacuum chamber, the lock-in amplifier outputs excitation signals to the sample’s driving electrodes and receives detection signals from the sample’s sensing electrodes.
Initially, the modal parameters of the sample are obtained using the spectrum analysis method and the decay time method, which include the natural frequencies of the N = 2 wine-glass modes and the frequency split. Based on the proposed harmonic identification method, a closed-loop control using the driving and sensing electrodes is employed to maintain constant amplitude resonance of the standing wave at four different azimuthal positions, θ1 to θ4. The LDV is used to measure the vibration at the anchor stem of the sample as B1 to B4, and also measure the vibration at the rim of the shell, which are used as parameters A1 to A4 substituted into (6) to calculate the magnitude and azimuth of the 1st harmonic.
By adjusting the position and angle of the resonator sample using the motion platform, the 1st harmonic and its corresponding azimuth φ1 are aligned with the ion beam outlet. The ion beam is then activated to continuously bombard the surface of the sample’s shell to achieve trimming.
The DT scheme, consisting of PE and AE steps, is first validated on a sample hemispherical resonator, with the results depicted in
Figure 13. Following the initial identification of the 1st harmonic and frequency split, a PE groove is created by etching for 60 min at the azimuth
φ1 corresponding to the 1st harmonic. After the primary etching, the 1st harmonic is reduced from 1462 ppm to 1210 ppm, a decrease of 17.2%. However, the frequency split increased by 62.7% from 1196.1 mHz to 1946 mHz. With the ion beam diameter maintained constant, two AE grooves are formed by etching for 30 min on both sides at 45 degrees. This results in a slight reduction of the 1st harmonic from 1210 ppm to 1100 ppm, while the frequency split is reduced from 1946 mHz to 1170 mHz, nearly returning to the initial frequency split. This demonstrates that the AE grooves could suppress frequency split by compensating for the 4th harmonic. Subsequently, a complete DT process is conducted, with the PE groove etched for 90 min and the AE grooves etched for 45 min each. After this process, the 1st harmonic is further reduced to 404.3 ppm, and the frequency split remained almost unchanged at 1164 mHz. This outcome illustrates that the DT approach can effectively reduce the 1st harmonic without introducing the 4th harmonic, thus preventing drastic changes in frequency split.
A DT experiment is also conducted on another resonator sample, and the changes in the 1st harmonic and frequency split during the etching process are compared with the results of the SPT experiment from previous work [
34], as shown in
Figure 14. In the figure, for DT, each step of trimming includes the total etching time for both the PE and AE grooves. After the SPT process, the 1st harmonic decreases from 723 ppm to 147.6 ppm, a reduction of 575.4 ppm. However, the frequency split sees a sharp increase from 0.3 Hz to 1.8 Hz. In contrast, the DT method, which lasted for 840 min, successfully reduces the 1st harmonic by 750 ppm. Throughout the process, the frequency split exhibits minimal fluctuations, with the maximum deviation reaching only 167.2 mHz, which is approximately 11% of the frequency split variation observed in the SPT scheme. The comparison results demonstrate that DT can achieve decoupling of the 1st and 4th harmonics, which is beneficial for optimizing the mass balance of hemispherical resonators.
5. Conclusions
The identification and trimming of multiple harmonics of the mass distribution in hemispherical resonators present greater challenges compared to traditional identification and trimming based on frequency split of resonant modes. Initially, a multi-harmonic identification scheme was employed to analyze the generation mechanisms of these harmonics. A trimming parameter model based on mass distribution functions and spectral analysis was constructed to examine the impact of etching groove parameters on multiple harmonics during the trimming process, which was subsequently validated through finite element simulations.
To address the issue of modal frequency split and mode mismatch caused by traditional single-point trimming of the 1st harmonic, this study proposes a discrete trimming scheme. This scheme compensates for the 4th harmonic introduced by trimming through auxiliary etching grooves, achieving decoupling of the 1st harmonic and frequency split during the trimming process. Finite element simulation results and experimental outcomes demonstrate that this scheme can perform 1st harmonic trimming without exacerbating frequency split.
Future work will explore the optimization of etching process and comprehensive trimming schemes for the first four harmonics, aiming to enhance mass balancing efficiency and improve the surface quality and circumferential symmetry of hemispherical resonators. Additionally, the performance enhancement effects of mass balance on hemispherical resonators and hemispherical resonator gyroscopes will be assessed.