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Journal: Micromachines, 2025
Volume: 16
Number: 350

Article: Predicting Thermal Resistance of Packaging Design by Machine Learning Models
Authors: by Jung-Pin Lai, Shane Lin, Vito Lin, Andrew Kang, Yu-Po Wang and Ping-Feng Pai
Link: https://www.mdpi.com/2072-666X/16/3/350

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