Next Article in Journal
The Integration of Artificial Intelligence with Micro–Nano-Systems: Perspectives, Challenges and Future Prospects
Next Article in Special Issue
Metal Surface Treatments for Enhanced Heat Transfer in Metal–Composite Hybrid Structures
Previous Article in Journal
Transforming Drug Discovery with Miniaturized Predictive Tissue Models
Previous Article in Special Issue
Low-Temperature Bonding for Heterogeneous Integration of Silicon Chips with Nanocrystalline Diamond Films
 
 

Order Article Reprints

Journal: Micromachines, 2025
Volume: 16
Number: 300

Article: Applications and Recent Advances of Low-Temperature Multicomponent Solders in Electronic Packaging: A Review
Authors: by Guodong Wu, Jingfang Shen, Ding Zhou, Muhammad Khairi Faiz and Yew Hoong Wong
Link: https://www.mdpi.com/2072-666X/16/3/300

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop