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Journal: Micromachines, 2025
Volume: 16
Number: 221
221
Article: The Effect of Through-Silicon-Via Thermal Stress on Metal-Oxide-Semiconductor Field-Effect Transistor Properties Under Cooling to Ultra-Low Temperatures
Authors: by Wenting Xie, Xiaoting Chen, Liting Zhang, Xiangjun Lu, Bing Ding and An Xie
Link: https://www.mdpi.com/2072-666X/16/2/221

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