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Journal: Micromachines, 2025
Volume: 16
Number: 221
Article:
The Effect of Through-Silicon-Via Thermal Stress on Metal-Oxide-Semiconductor Field-Effect Transistor Properties Under Cooling to Ultra-Low Temperatures
Authors:
by
Wenting Xie, Xiaoting Chen, Liting Zhang, Xiangjun Lu, Bing Ding and An Xie
Link:
https://www.mdpi.com/2072-666X/16/2/221
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