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Journal: Micromachines, 2025
Volume: 16
Number: 212

Article: Reliability Analysis of Complex PCB Assemblies Under Temperature Cycling and Random Vibration
Authors: by Wenchao Tian, Feiyang Li, Mang He, Haoyue Ji and Si Chen
Link: https://www.mdpi.com/2072-666X/16/2/212

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