Smith, E.; Alsaleh, N.A.; Ahmadein, M.; Elfar, A.A.; Hassanin, H.; Essa, K.
Pump-Free Insulin Delivery via an SLA-Printed Hollow Microneedle Patch with an Integrated Self-Sealing Reservoir. Micromachines 2025, 16, 1322.
https://doi.org/10.3390/mi16121322
AMA Style
Smith E, Alsaleh NA, Ahmadein M, Elfar AA, Hassanin H, Essa K.
Pump-Free Insulin Delivery via an SLA-Printed Hollow Microneedle Patch with an Integrated Self-Sealing Reservoir. Micromachines. 2025; 16(12):1322.
https://doi.org/10.3390/mi16121322
Chicago/Turabian Style
Smith, Evie, Naser A. Alsaleh, Mahmoud Ahmadein, Abdullah A. Elfar, Hany Hassanin, and Khamis Essa.
2025. "Pump-Free Insulin Delivery via an SLA-Printed Hollow Microneedle Patch with an Integrated Self-Sealing Reservoir" Micromachines 16, no. 12: 1322.
https://doi.org/10.3390/mi16121322
APA Style
Smith, E., Alsaleh, N. A., Ahmadein, M., Elfar, A. A., Hassanin, H., & Essa, K.
(2025). Pump-Free Insulin Delivery via an SLA-Printed Hollow Microneedle Patch with an Integrated Self-Sealing Reservoir. Micromachines, 16(12), 1322.
https://doi.org/10.3390/mi16121322