Chung, S.-H.; Yeom, H.-S.; Kim, C.-H.; Kim, Y.-K.; Lee, S.-K.; Baek, C.-W.; Park, J.-H.
Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave Applications. Micromachines 2025, 16, 12.
https://doi.org/10.3390/mi16010012
AMA Style
Chung S-H, Yeom H-S, Kim C-H, Kim Y-K, Lee S-K, Baek C-W, Park J-H.
Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave Applications. Micromachines. 2025; 16(1):12.
https://doi.org/10.3390/mi16010012
Chicago/Turabian Style
Chung, Seung-Han, Ho-Sun Yeom, Che-Heung Kim, Yong-Kweon Kim, Seung-Ki Lee, Chang-Wook Baek, and Jae-Hyoung Park.
2025. "Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave Applications" Micromachines 16, no. 1: 12.
https://doi.org/10.3390/mi16010012
APA Style
Chung, S.-H., Yeom, H.-S., Kim, C.-H., Kim, Y.-K., Lee, S.-K., Baek, C.-W., & Park, J.-H.
(2025). Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave Applications. Micromachines, 16(1), 12.
https://doi.org/10.3390/mi16010012
