Feng, Y.; Yu, H.; Liu, W.; Hu, K.; Sun, S.; Yang, Z.; Wang, B.
Grooving and Absorption on Substrates to Reduce the Bulk Acoustic Wave for Surface Acoustic Wave Micro-Force Sensors. Micromachines 2024, 15, 637.
https://doi.org/10.3390/mi15050637
AMA Style
Feng Y, Yu H, Liu W, Hu K, Sun S, Yang Z, Wang B.
Grooving and Absorption on Substrates to Reduce the Bulk Acoustic Wave for Surface Acoustic Wave Micro-Force Sensors. Micromachines. 2024; 15(5):637.
https://doi.org/10.3390/mi15050637
Chicago/Turabian Style
Feng, Yang, Haoda Yu, Wenbo Liu, Keyong Hu, Shuifa Sun, Zhen Yang, and Ben Wang.
2024. "Grooving and Absorption on Substrates to Reduce the Bulk Acoustic Wave for Surface Acoustic Wave Micro-Force Sensors" Micromachines 15, no. 5: 637.
https://doi.org/10.3390/mi15050637
APA Style
Feng, Y., Yu, H., Liu, W., Hu, K., Sun, S., Yang, Z., & Wang, B.
(2024). Grooving and Absorption on Substrates to Reduce the Bulk Acoustic Wave for Surface Acoustic Wave Micro-Force Sensors. Micromachines, 15(5), 637.
https://doi.org/10.3390/mi15050637
