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Journal: Micromachines, 2024
Volume: 15
Number: 482
Article:
Piezoelectric Micromachined Ultrasonic Transducers with Micro-Hole Inter-Etch and Sealing Process on (111) Silicon Wafer
Authors:
by
Yunhao Wang, Sheng Wu, Wenjing Wang, Tao Wu and Xinxin Li
Link:
https://www.mdpi.com/2072-666X/15/4/482
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