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Journal: Micromachines, 2024
Volume: 15
Number: 418
Article:
IC Packaging Material Identification via a Hybrid Deep Learning Framework with CNN–Transformer Bidirectional Interaction
Authors:
by
Chengbin Zhang, Xuankai Zhou, Nian Cai, Shuai Zhou and Han Wang
Link:
https://www.mdpi.com/2072-666X/15/3/418
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