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Journal: Micromachines, 2024
Volume: 15
Number: 418

Article: IC Packaging Material Identification via a Hybrid Deep Learning Framework with CNN–Transformer Bidirectional Interaction
Authors: by Chengbin Zhang, Xuankai Zhou, Nian Cai, Shuai Zhou and Han Wang
Link: https://www.mdpi.com/2072-666X/15/3/418

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