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Journal: Micromachines, 2024
Volume: 15
Number: 1370
1370
Article: A Study on Regulating the Residual Stress of Electroplated Cu by Manipulating the Nanotwin Directions
Authors: by Gangli Yang, Tailong Shi, Liu Chang, Hongjia Zhu, Dongyu Tong, Wending Yang, Zeyuan Li and Liyi Li
Link: https://www.mdpi.com/2072-666X/15/11/1370

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