Article Versions Notes

Yang G, Shi T, Chang L, Zhu H, Tong D, Yang W, Li Z, Li L. A Study on Regulating the Residual Stress of Electroplated Cu by Manipulating the Nanotwin Directions. Micromachines. 2024; 15(11):1370. https://doi.org/10.3390/mi15111370

Yang, Gangli, Tailong Shi, Liu Chang, Hongjia Zhu, Dongyu Tong, Wending Yang, Zeyuan Li, and Liyi Li. 2024. "A Study on Regulating the Residual Stress of Electroplated Cu by Manipulating the Nanotwin Directions" Micromachines 15, no. 11: 1370. https://doi.org/10.3390/mi15111370

Yang, G., Shi, T., Chang, L., Zhu, H., Tong, D., Yang, W., Li, Z., & Li, L. (2024). A Study on Regulating the Residual Stress of Electroplated Cu by Manipulating the Nanotwin Directions. Micromachines, 15(11), 1370. https://doi.org/10.3390/mi15111370