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Journal: Micromachines, 2024
Volume: 15
Number: 1311

Article: Design and Optimization of a Fan-Out Wafer-Level Packaging- Based Integrated Passive Device Structure for FMCW Radar Applications
Authors: by Jiajie Yang, Lixin Xu and Ke Yang
Link: https://www.mdpi.com/2072-666X/15/11/1311

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