Next Article in Journal
High Performance Pd/4H-SiC Epitaxial Schottky Barrier Radiation Detectors for Harsh Environment Applications
Next Article in Special Issue
Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging
Previous Article in Journal
A High-Power 170 GHz in-Phase Power-Combing Frequency Doubler Based on Schottky Diodes
Previous Article in Special Issue
Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach
 
 

Order Article Reprints

Journal: Micromachines, 2023
Volume: 14
Number: 1531

Article: An RDL Modeling and Thermo-Mechanical Simulation Method of 2.5D/3D Advanced Package Considering the Layout Impact Based on Machine Learning
Authors: by Xiaodong Wu, Zhizhen Wang, Shenglin Ma, Xianglong Chu, Chunlei Li, Wei Wang, Yufeng Jin and Daowei Wu
Link: https://www.mdpi.com/2072-666X/14/8/1531

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop