Article Versions Notes

Feng W, Li P, Zhang H, Sun K, Li W, Wang J, Yang H, Li X. Silicon Micromachined TSVs for Backside Interconnection of Ultra-Small Pressure Sensors. Micromachines. 2023; 14(7):1448. https://doi.org/10.3390/mi14071448

Feng, Weiwen, Peng Li, Haozhi Zhang, Ke Sun, Wei Li, Jiachou Wang, Heng Yang, and Xinxin Li. 2023. "Silicon Micromachined TSVs for Backside Interconnection of Ultra-Small Pressure Sensors" Micromachines 14, no. 7: 1448. https://doi.org/10.3390/mi14071448

Feng, W., Li, P., Zhang, H., Sun, K., Li, W., Wang, J., Yang, H., & Li, X. (2023). Silicon Micromachined TSVs for Backside Interconnection of Ultra-Small Pressure Sensors. Micromachines, 14(7), 1448. https://doi.org/10.3390/mi14071448