Next Article in Journal
Reconfigurable Terahertz Spatial Deflection Varifocal Metamirror
Next Article in Special Issue
Cu-Cu Thermocompression Bonding with a Self-Assembled Monolayer as Oxidation Protection for 3D/2.5D System Integration
Previous Article in Journal
Multi-Layered Bipolar Ionic Diode Working in Broad Range Ion Concentration
Previous Article in Special Issue
Direct Numerical Simulation of Surface Wrinkling for Extraction of Thin Metal Film Material Properties
 
 

Order Article Reprints

Journal: Micromachines, 2023
Volume: 14
Number: 1312

Article: FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation
Authors: by Seonho Seok
Link: https://www.mdpi.com/2072-666X/14/7/1312

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop