Zhou, T.; Li, Z.; Guo, W.; Liu, P.; Zhao, B.; Wang, X.
A Study on the Material Removal Characteristics and Damage Mechanism of Lapping for Pressureless Sintered Silicon Carbide (SSiC) Microlens Cavity. Micromachines 2023, 14, 1162.
https://doi.org/10.3390/mi14061162
AMA Style
Zhou T, Li Z, Guo W, Liu P, Zhao B, Wang X.
A Study on the Material Removal Characteristics and Damage Mechanism of Lapping for Pressureless Sintered Silicon Carbide (SSiC) Microlens Cavity. Micromachines. 2023; 14(6):1162.
https://doi.org/10.3390/mi14061162
Chicago/Turabian Style
Zhou, Tianfeng, Zhongyi Li, Weijia Guo, Peng Liu, Bin Zhao, and Xibin Wang.
2023. "A Study on the Material Removal Characteristics and Damage Mechanism of Lapping for Pressureless Sintered Silicon Carbide (SSiC) Microlens Cavity" Micromachines 14, no. 6: 1162.
https://doi.org/10.3390/mi14061162
APA Style
Zhou, T., Li, Z., Guo, W., Liu, P., Zhao, B., & Wang, X.
(2023). A Study on the Material Removal Characteristics and Damage Mechanism of Lapping for Pressureless Sintered Silicon Carbide (SSiC) Microlens Cavity. Micromachines, 14(6), 1162.
https://doi.org/10.3390/mi14061162