Next Article in Journal
Interconnection Technologies for Flexible Electronics: Materials, Fabrications, and Applications
Next Article in Special Issue
A Review of Fingerprint Sensors: Mechanism, Characteristics, and Applications
Previous Article in Journal
High-Speed Hardware Architecture Based on Error Detection for KECCAK
Previous Article in Special Issue
Design and Fabrication of a High-Temperature SOI Pressure Sensor with Optimized Crossbeam Membrane
 
 
Article

Article Versions Notes

Micromachines 2023, 14(6), 1130; https://doi.org/10.3390/mi14061130
Action Date Notes Link
article pdf uploaded. 27 May 2023 15:50 CEST Version of Record https://www.mdpi.com/2072-666X/14/6/1130/pdf-vor
article xml file uploaded 29 May 2023 10:14 CEST Original file -
article xml uploaded. 29 May 2023 10:14 CEST Update https://www.mdpi.com/2072-666X/14/6/1130/xml
article pdf uploaded. 29 May 2023 10:14 CEST Updated version of record https://www.mdpi.com/2072-666X/14/6/1130/pdf
article html file updated 29 May 2023 10:16 CEST Original file https://www.mdpi.com/2072-666X/14/6/1130/html
Back to TopTop