Liu, C.; Song, J.; Zhao, G.; Yin, Y.; Ding, Q.
Improving Thermal Conductivity and Tribological Performance of Polyimide by Filling Cu, CNT, and Graphene. Micromachines 2023, 14, 616.
https://doi.org/10.3390/mi14030616
AMA Style
Liu C, Song J, Zhao G, Yin Y, Ding Q.
Improving Thermal Conductivity and Tribological Performance of Polyimide by Filling Cu, CNT, and Graphene. Micromachines. 2023; 14(3):616.
https://doi.org/10.3390/mi14030616
Chicago/Turabian Style
Liu, Chen, Jingfu Song, Gai Zhao, Yuhang Yin, and Qingjun Ding.
2023. "Improving Thermal Conductivity and Tribological Performance of Polyimide by Filling Cu, CNT, and Graphene" Micromachines 14, no. 3: 616.
https://doi.org/10.3390/mi14030616
APA Style
Liu, C., Song, J., Zhao, G., Yin, Y., & Ding, Q.
(2023). Improving Thermal Conductivity and Tribological Performance of Polyimide by Filling Cu, CNT, and Graphene. Micromachines, 14(3), 616.
https://doi.org/10.3390/mi14030616