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Journal: Micromachines, 2023
Volume: 14
Number: 588

Article: Effects of Voids on Thermal Fatigue Reliability of Solder Joints on Inner Rings in Ball Grid Array Packaging by Finite Element Analysis
Authors: by Xingwang Hu, Li Liu, Sheng Liu, Meng Ruan and Zhiwen Chen
Link: https://www.mdpi.com/2072-666X/14/3/588

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