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Journal: Micromachines, 2023
Volume: 14
Number: 399

Article: A 3C-SiC-on-Insulator-Based Integrated Photonic Platform Using an Anodic Bonding Process with Glass Substrates
Authors: by Jiayang Li and Andrew W. Poon
Link: https://www.mdpi.com/2072-666X/14/2/399

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