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Journal: Micromachines, 2023
Volume: 14
Number: 2242
Article:
A Method for Fast Au-Sn Bonding at Low Temperature Using Thermal Gradient
Authors:
by
Wenchao Wang, Ziyu Liu, Delong Qiu, Zhiyuan Zhu, Na Yan, Shijin Ding and David Wei Zhang
Link:
https://www.mdpi.com/2072-666X/14/12/2242
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