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Journal: Micromachines, 2023
Volume: 14
Number: 2025

Article: An Analytical Thermal Buckling Model for Semiconductor Chips on a Substrate
Authors: by Guangping Gong, Dian Xu, Sijun Xiong, Fangyu Yi, Chengbo Wang and Rui Li
Link: https://www.mdpi.com/2072-666X/14/11/2025

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