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Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes
 
 

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Journal: Micromachines, 2023
Volume: 14
Number: 1957

Article: Research on the Mass Adding and Removing Combined Mechanical Trimming Method of the Ring MEMS Gyroscope
Authors: by Xinyu Wang, Kai Wu, Chengxiang Wang, Qingsong Li, Zhanqiang Hou, Dingbang Xiao and Xuezhong Wu
Link: https://www.mdpi.com/2072-666X/14/10/1957

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