Zhang, X.; Yao, C.; Niu, J.; Li, H.; Xie, C.
Wafer-Scale Fabrication of Ultra-High Aspect Ratio, Microscale Silicon Structures with Smooth Sidewalls Using Metal Assisted Chemical Etching. Micromachines 2023, 14, 179.
https://doi.org/10.3390/mi14010179
AMA Style
Zhang X, Yao C, Niu J, Li H, Xie C.
Wafer-Scale Fabrication of Ultra-High Aspect Ratio, Microscale Silicon Structures with Smooth Sidewalls Using Metal Assisted Chemical Etching. Micromachines. 2023; 14(1):179.
https://doi.org/10.3390/mi14010179
Chicago/Turabian Style
Zhang, Xiaomeng, Chuhao Yao, Jiebin Niu, Hailiang Li, and Changqing Xie.
2023. "Wafer-Scale Fabrication of Ultra-High Aspect Ratio, Microscale Silicon Structures with Smooth Sidewalls Using Metal Assisted Chemical Etching" Micromachines 14, no. 1: 179.
https://doi.org/10.3390/mi14010179
APA Style
Zhang, X., Yao, C., Niu, J., Li, H., & Xie, C.
(2023). Wafer-Scale Fabrication of Ultra-High Aspect Ratio, Microscale Silicon Structures with Smooth Sidewalls Using Metal Assisted Chemical Etching. Micromachines, 14(1), 179.
https://doi.org/10.3390/mi14010179