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Journal: MicromachinesVolume: 13Number: 1543
Article: High Quality Pt–Pt Metal Bonding for High Temperature Packaging
  • Authors:
  • Jiazheng Liu1,2,
  • Junqiang Wang1,2,* and
  • Mengwei Li1,2,*
  • et al.
Link: https://www.mdpi.com/2072-666X/13/9/1543

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